SEC_Xeye 6200

X-ray for Wire bonding & Substrate Inspection.

 High Speed 2D in-Line Inspection Systems.(~0.5 sec/FOV)                                                                             Auto inspection algorithm for Semiconductor                                                                                               In-line inspection Wire bonding, Flip Chip Micro Bump package                                                             Able to handle substrate, JDEC Tray and Carrier                                                                                                 High Speed 2D In Line Inspection for Mass Production                                                                                   Best Solution for wire product and substrate and lower cost for maintenance                                             Under 2% underkill inspection system

  • X-ray tube: 160kV/ 500µA
  • Min Resolution: 0.8µm
  • Table size: 322 x 136mm
  • Detector: 9.6M Pixel, 30fps
  • Inspection Object: Wire bonding or substrate
  • Defect Types(Wire): Broken, Missing, Foreign material, etc
  • Defect Types(Micro bump): Big/Small, Missing, Misalign, Short, etc
  • Dimension: 1,460(W) x 1,670(D) x 1,650(H) mm / 2,900kg

Please contact as below if you have interesting in Automated X-ray Inspection systems. 

 Maria-Reiche-Straße 1 01109, Dresden, Germany

 Tel. +49-351-8889-0271                                       Fax. +49-351-8889-0274
 Email. seceng-eu@seceng.co.kr

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