SEC_Xeye6300

X-ray for Semiconductor & Batteries Inspection.

 High Speed & High Quality CT auto inspection.(~4.3 sec/FOV)                                                                       Image comparison regarding mechanism.                                                                                                   High Resolution Image with Oblique CT for big sample.                                                                           High Speed 3D In Line Inspection for Mass Production.                                                                               X-ray damage reduction concept. Lower cost for maintenance.                                                             Best Solution for both-side layered PCB.                                                                                                   Various defects detectable-BGA, Chip component and etc.

  • X-ray tube: 160kV/ 500µA
  • Min Resolution: 0.8~1.5µm
  • Table size: Max 330 x 250mm, Min 50 x 50mm
  • Detector: 12inch FPXD
  • Inspection Object: BGA, Through Hole, Chip, QFN, QFP
  • Defect Types: PoP, BGA, Connector, Through Hole, Component
  • Dimension: 1,360(W) x 1,880(D) x 1,700(H) mm / 4,200kg

Please contact as below if you have interesting in Automated X-ray Inspection systems. 

 Maria-Reiche-Straße 1 01109, Dresden, Germany

 Tel. +49-351-8889-0271                                       Fax. +49-351-8889-0274
 Email. seceng-eu@seceng.co.kr

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