SMD resistor of PCB
For Electronics, PCB borad, Computer, ETC.
SEC Co., Ltd / SEC Europe Head Offcie / Automated X-ray Inspection / Nanotech Digital GmbH / Analysis report
» Analysis systems : by SEC Co.,Ltd
» Inspection method: 3D
» Model type: Stand-alone, Semi auto
» Model name: SF160FCT
Voids can be found in BGA solder balls, or between solder joints and BGAs, or between solder joints and PCB.
This can be caused by voids in the original solder ball, or during the reflow process.
Also, This is tightening the problem of not evenly distributed current or part heat and is causing stress and cracks.
Voids have factors that reduce reliability,
and managing this is one of the factors that increase reliability.
Most major EMS Companies or automotive manufacturers inspection Voids and crack as part of quality control by SEC Co., Ltd X-ray inspection systems.