X-ray for Small size assembly products Inspection. High Speed 3D(Cone beam CT) In-Line Inspection Systems for assembly production and small diecasting.(Tact time: 18 seconds per 1ea) Auto inspection algorithm for Semiconductor Available to inspect with slice images 100% defect detection, under 2% underkill & overkill Under 2% underkill inspection system
Please contact as below if you have interesting in Automated X-ray Inspection systems.
Maria-Reiche-Straße 1 01109, Dresden, Germany
Tel. +49-351-8889-0271 Fax. +49-351-8889-0274