SEC_Xeye 7300

X-ray for Small size assembly products Inspection.                                High Speed 3D(Cone beam CT) In-Line Inspection Systems for assembly production and small diecasting.(Tact time: 18 seconds per 1ea)                                                                                                   Auto inspection algorithm for Semiconductor                           Available to inspect with slice images                                                       100% defect detection, under 2% underkill & overkill                               Under 2% underkill inspection system

Please contact as below if you have interesting in Automated X-ray Inspection systems. 

 Maria-Reiche-Straße 1 01109, Dresden, Germany

 Tel. +49-351-8889-0271                 Fax. +49-351-8889-0274

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