SEC_Xeye 7300
X-ray for Small size assembly products Inspection. High Speed 3D(Cone beam CT) In-Line Inspection Systems for assembly production and small diecasting.(Tact time: 18 seconds per 1ea) Auto inspection algorithm for Semiconductor Available to inspect with slice images 100% defect detection, under 2% underkill & overkill Under 2% underkill inspection system
- X-ray tube: 160kV/ 500µA
- Min Resolution: 0.8µm
- Table size: Max 200mm x 200mm per 1 FOV
- Detector: 9M Flat panel X-ray detector
- Inspection Object: Small size assembly products
- Defect Types: Missing, Short, Void, Battel Pin filling, etc
- Dimension: 1,480(W) x 2,270(D) x 2,055(H) mm / 2,900kg
Please contact as below if you have interesting in Automated X-ray Inspection systems.
Maria-Reiche-Straße 1 01109, Dresden, Germany
Tel. +49-351-8889-0271 Fax. +49-351-8889-0274
Email. seceng-eu@seceng.co.kr